By ALLRESIST GmbH
Supplier Info
Product Type:
Parts & Consumables
Application:
Chemicals & Photoresists
Product Description:
The Allresist AR-P 639 Series is a high-resolution positive photoresist designed for advanced semiconductor, MEMS, and micro/nanofabrication applications. Engineered for precise patterning, high sensitivity, and excellent reproducibility, it supports submicron and nanometer-scale lithography, making it ideal for both research and industrial fabrication.
Characterisation
- E-beam, deep UV (248 nm).
- Very good adhesion to glass, silicon and metals.
- For planarization and multi-layer processes.
- Highest resolution, high contrast.
- Poly(methyl methacrylate) with diff. molecular weights.
AR-P 639.04 Properties:
- Film thickness/4.000 rpm: 0.08 µm
- Resolution best value: 6 nm
- Flash point: 36 °C
- Storage temperature: 10-22 °C
Available to order in pack sizes:
- 100 ml
- 250 ml
- 1L
Pricing available on request.
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Processing Instructions For Coating:
Large undercut structures (lift-off) are obtained if PMMA resists with different molecular weight are chosen for a two component system. As upper layer, an ethyl lactate PMMA is recommended since ethyl lactate does not, in contrast to other solvents, attack the second layer. For the lower layer, a chlorobenzene, anisole or ethyl lactate PMMA is suitable. Both tempering steps are performed at 150 °C.
Recommendation: large undercut (low resolution): bottom layer 50K, upper layer 200K, 600K or 950K. High resolution (smaller undercut): bottom layer 600K, upper layer 950K.