By ALLRESIST GmbH
Supplier Info
Product Type:
Parts & Consumables
Application:
Chemicals & Photoresists
Product Description:
The Allresist AR-P 3100 Series is a high-resolution positive photoresist designed for advanced semiconductor, MEMS, and micro-/nanofabrication applications. Engineered for precision, reproducibility, and process stability, it enables submicron patterning with excellent uniformity and reliability.
Characterisation
- broadband UV, i-line, g-line
- high photosensitivity, high resolution
- strong adhesion to critical glass/chromium surfaces for extreme stresses during wet-chemical etching processes
- for the production of CD masters and lattice structures
- 3170 also suitable for laser interference lithography
- plasma etching resistant
- combination of novolac and naphthoquinone diazide
- Safer Solvent PGMEA
AR-P 3110 Properties:
- Solids content: 28%
- Viscosity 25 °C: 12 mPas
- Film thickness/4.000 rpm: 1000 nm
- Resolution: 0.5 µm
- Flash Point: 42 °C
- Storage 6 month: 10-18 °C
AR-P 3120 Properties:
- Solids content: 21%
- Viscosity 25 °C: 5 mPas
- Film thickness/4.000 rpm: 550 nm
- Resolution: 0.4 µm
- Flash Point: 42 °C
- Storage 6 month: 10-18 °C
AR-P 3170 Properties:
- Solids content: 8%
- Viscosity 25 °C: 2 mPas
- Film thickness/4.000 rpm: 120 nm
- Resolution: 0.4 µm
- Flash Point: 42 °C
- Storage 6 month: 10-18 °C
Available to order in pack sizes:
- 100 ml
- 250 ml
- 1L
Pricing available on request.
file_downloadAR-P3100_english_Allresist_product_information.pdf
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