By ALLRESIST GmbH
Supplier Info
Product Type:
Parts & Consumables
Application:
Chemicals & Photoresists
Product Description:
The Allresist AR-P 5300 Series is a high-resolution positive photoresist designed for advanced semiconductor, MEMS, and micro-/nanofabrication applications. It provides excellent resolution, high contrast, and reliable process reproducibility, making it suitable for both research and industrial-scale lithography.
Characterisation
- broadband UV, i-line, g-line
- high photosensitivity, high resolution
- good adhesion properties
- for undercut structures for the production of evaporation samples, in particular of metal using lift-off techniques e.g. for conductor paths
- plasma etching resistant, temperature stable up to 120 °C
- combination of novolac and naphthoquinone diazide
- safer solvent PGMEA
AR-P 5350 Properties:
- Solids content: 25%
- Viscosity 25 °C: 38 mPas
- Film thickness/4.000 rpm: 1.4 µm
- Resolution: 0.7 µm
- Flash Point: 44 °C
- Storage temperature: 10-18 °C
Available to order in pack sizes:
- 100 ml
- 250 ml
- 1L
Pricing available on request.
file_downloadAR-P5300_english_Allresist_product_information.pdf
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Processing Instructions:
Tempering: Higher tempering temperatures are required to produce the undercut.
Development: The undercut of resist structures is generated during aqueous-alkaline development.