By ALLRESIST GmbH
Supplier Info
Product Type:
Parts & Consumables
Application:
Chemicals & Photoresists
Product Description:
Allresist AR 300-40 metal ion-free developer ensures high-resolution photoresist development for semiconductor, MEMS, and micro/nanofabrication processes.
Characterisation:
- metal ion-free aqueous-alkaline solutions for the processing of photo/ e-beam resists
- reduce the risk of metal ion contamination at the substrate surface
- residue-free development
- metal ion content < 0.1 ppm
- main component TMAH
AR 300-44 Properties:
- Normality: 0.26 (n)
- Density at 20 °C: 0.99 g/cm3
- Surface tension: 32 max mN/m
- Filtration: 0.2 µm
- Storage 6 month: 10-22 °C
AR 300-46 Properties:
- Normality: 0.24 (n)
- Density at 20 °C: 0.99 g/cm3
- Surface tension: 32 max mN/m
- Filtration: 0.2 µm
- Storage 6 month: 10-22 °C
AR 300-47 Properties:
- Normality: 0.20 (n)
- Density at 20 °C: 0.99 g/cm3
- Surface tension: 32 max mN/m
- Filtration: 0.2 µm
- Storage 6 month: 10-22 °C
AR 300-475 Properties:
- Normality: 0.17 (n)
- Density at 20 °C: 0.99 g/cm3
- Surface tension: 32 max mN/m
- Filtration: 0.2 µm
- Storage 6 month: 10-22 °C
Available to order in pack sizes:
- 2.5L
- 5L
Pricing available on request.
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Information on developer processing (→ see also information on developers AR 300-26 and 300-35):
If metal ion-free developers are diluted, it is recommended to adjust the desired normality immediately prior to use by very careful dilution (with scales) of the stronger developer with DI water. Even small differences in normality may cause larger differences in the development rate. Developers should be used as fast as possible, since otherwise developer efficacy may be reduced.