By ALLRESIST GmbH
Supplier Info
Product Type:
Parts & Consumables
Application:
Chemicals & Photoresists
Product Description:
AR 600-50, -51, 600-546, -548, -549, 600-55, -56 developer
For the development of e-beam resists films
Characterisation:
- ultrapure, ultra-filtered (0.2 µm) solvent mixtures
- storage at 10-22 °C for 6 month
AR 600-50 Properties:
- Main component(s): methoxypropanol / isopropyl alcohol
- Density at 20 °C: 0.871 g/cm3
- Refractive index at 20 °C: 1.395
- Water content max.: 0.1 %
- Flash Point: 21 °C
- Available to order in 1L bottles
AR 600-546 Properties:
- Weaker developer
- Main component(s): amyl acetate
- Density at 20 °C: 0.876 g/cm3
- Refractive index at 20 °C: 1.402
- Water content max.: 0.1 %
- Flash Point: 41 °C
- Available to order in 2.5L bottles
AR 600-548 Properties:
- Strong developer
- Main component(s): diethyl ketone / diethyl malonate
- Density at 20 °C: 0.917 g/cm3
- Refractive index at 20 °C: 1.401
- Water content max.: 0.1 %
- Flash Point: 22 °C
- Available to order in 1L bottles
AR 600-549 Properties:
- Moderate developer
- Main component(s): diethyl malonate / anisole
- Density at 20 °C: 1.053 g/cm3
- Refractive index at 20 °C: 1.417
- Water content max.: 0.1 %
- Flash Point: 85 °C
- Available to order in 1L bottles
AR 600-55 Properties:
- Strong developer
- Main component(s): methyl isobutyl ketone (MIBK)
- Density at 20 °C: 0.792 g/cm3
- Refractive index at 20 °C: 1.384
- Water content max.: 0.1 %
- Flash Point: 12 °C
- Available to order in 1L bottles
AR 600-56 Properties:
- Weaker developer
- Main component(s): methyl isobutyl ketone (MIBK)
- Density at 20 °C: 0.788 g/cm3
- Refractive index at 20 °C: 1.381
- Water content max.: 0.1 %
- Flash Point: 12 °C
- Available to order in 2.5L bottles
Pricing for all available on request.
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Information on developer processing:
The choice of the developer strongly influences the development rate, the sensitivity and the profile of the resist structures. Coated and exposed substrates are treated with developers which are suitable for the respective process (puddle, spray, immersion bath) at a temperature of 21-23 °C kept as constant as possible. The required development time depends in each case on the resist film thickness. Films with a thickness of less than 0.2 µm can for example be completely developed after 30 s. The development process can be slowed down for AR 600-50, -55 and -56 by adding 10-20 % of the stopper AR 600-60.
Weaker developers like AR 600-56 and AR 600-546 provide a higher resolution without dark erosion, while a significantly higher sensitivity with at the same time higher dark erosion can be obtained with developers AR 600-55 and AR 600-548. If CSAR 62 is processed with developer AR 600-548 at a development temperature of about 0 °C, even after 10 minutes no erosion is observed at the prolonged development time. Substrates have to be rinsed immediately after development for 30 seconds with stopper and are subsequently dried