By ALLRESIST GmbH
Supplier Info
Product Type:
Parts & Consumables
Application:
Chemicals & Photoresists
Product Description:
The Allresist AR-P 617 Series is a high-resolution positive photoresist engineered for advanced semiconductor, MEMS, and microfabrication applications. Designed to deliver precise patterning and reliable performance, it is ideal for both research and industrial lithography processes requiring submicron resolution.
Characterisation
- E-beam, deep UV (248 nm).
- Highest resolution, high contrast.
- Strong adhesion to glass, silicon and metals.
- 3-4 times more sensitive than PMMA.
- Sensitivity can be adjusted via the softbake.
- For planarization and multi-layer processes.
- Temperature-stable up to 240 °C.
- Copolymer on the basis of methyl methacrylate and methacrylic acid, safer solvent 1-methoxy-2-propanol.
AR-P 617.03 Properties:
- Solids content: 3.0%
- Film thickness/4.000 rpm: 0.09 µm
- Storage 6 month: 10-22 °C
AR-P 617.06 Properties:
- Solids content: 6.0%
- Film thickness/4.000 rpm: 0.29 µm
- Storage 6 month: 10-22 °C
AR-P 617.08 Properties:
- Solids content: 8.0%
- Film thickness/4.000 rpm: 0.48 µm
- Storage 6 month: 10-22 °C
AR-P 617.14 Properties:
- Solids content: 14.0%
- Film thickness/4.000 rpm: 1.75 µm
- Storage 6 month: 10-22 °C
Available to order in pack sizes:
- 100 ml
- 250 ml
- 1L
Pricing available on request.
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Processing Instructions:
The sensitivity of the resist increases with increasing softbake temperature due to the more intense formation of anhydrides of the methacrylic acid under separation of water ( diagram dose vs. softbake temperature). AR-P 617 tempered at 200 °C is therefore about 20 % more sensitive as compared to a tempering at 180 °C. The dose can be adjusted accordingly, which is of major importance for two-layer systems with two layers of AR-P 617. In this case, at first the bottom layer is dried at 200 °C and then tempered at 180 °C together with the upper film.
Due to differentiation processes, the lower layer is attacked faster by the developer and pronounced undercut structures are formed (lift-off). These lift-off structures can also be produced with the two-layer system PMMA/ copolymer. At first AR-P 617 is coated and tempered at 190 °C, then the PMMA resist AR-P 679.03 is applied by spin-coating and dried at 150 °C. After exposure, both layers are developed in one step e.g. with AR 600-56, treated with stopper AR 600-60 and rinsed.