By ALLRESIST GmbH
Supplier Info
Product Type:
Parts & Consumables
Application:
Chemicals & Photoresists
Product Description:
The Allresist AR-P 6200 Series (CSAR 62) is a high-resolution positive photoresist designed for advanced semiconductor, MEMS, and nanofabrication applications. Renowned for its outstanding resolution, high contrast, and reliability, it enables precise patterning at the submicron and nanometer scale, making it ideal for both research and industrial lithography processes.
Characterisation
- e-beam; layer thickn. 0,05-1,6 μm (6000-1000 rpm)
- high sensitivity which can be adjusted via the developer
- highest resolution (< 10 nm) and very high contrast
- highly process-stable, high plasma etching resistance
- easy fabrication of lift-off structures
- poly(α-methyl styrene-co-α-chloroacrylate methylester)
- Safer Solvent Anisole
AR-P 6200.04 Properties:
- Solids content: 4%
- Viscosity 25 °C: 2 mPas
- Film thickness/4.000 rpm: 0.08 µm
- Storage 6 month: 10-22 °C
AR-P 6200.09 Properties:
- Solids content: 9%
- Viscosity 25 °C: 6 mPas
- Film thickness/4.000 rpm: 0.20 µm
- Storage 6 month: 10-22 °C
AR-P 6200.13 Properties:
- Solids content: 13%
- Viscosity 25 °C: 11 mPas
- Film thickness/4.000 rpm: 0.40 µm
- Storage 6 month: 10-22 °C
AR-P 6200.18 Properties:
- Solids content: 18%
- Viscosity 25 °C: 29 mPas
- Film thickness/4.000 rpm: 0.80 µm
- Storage 6 month: 10-22 °C
Available to order in pack sizes:
- 30ml
- 100 ml
- 250 ml
- 1L
Pricing available on request.
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Processing Instructions:
Development: For the development of exposed resist films, developers AR 600-546, 600-548 and 600-549 are recommended. As weaker developer, AR 600-546 provides a wider process window. If the stronger developer AR 600-548 is used, the sensitivity can be increased 6-fold to < 10 μC/cm². The intermediate developer AR 600-549 renders the CSAR 62 twice as sensitive as compared to AR 600-546, it shows also no dark erosion and has a contrast of 4.
For immersion development, generally development times of 30 – 60 seconds are recommended. If developer AR 600-546 is used, even after 10 minutes at room temperature no erosion of unexposed areas is detected.
Developer AR 600-548 in contrast attacks resist surfaces already after two minutes visibly. If however the development process is carried out at temperatures of approx. 0 °C, no dark erosion is observed even after 5 minutes (which is however associated with a reduction of sensitivity).
The development procedure should be stopped quickly. For this purpose, the substrate is moved for 30 seconds in stopper AR 600-60. Optionally, the substrate may thereafter be rinsed for 30 seconds with DI water to remove all residual solvent.