By ALLRESIST GmbH
Supplier Info
Product Type:
Parts & Consumables
Application:
Chemicals & Photoresists
Product Description:
The Allresist AR-P 632 Series is a high-resolution positive photoresist engineered for advanced semiconductor, MEMS, and microfabrication applications. It is designed to deliver precise patterning, excellent reproducibility, and reliable performance, making it ideal for both research and industrial lithography processes requiring submicron resolution.
Characterisation:
- E-beam, deep UV (248 nm).
- Very good adhesion to glass, silicon and metals.
- For planarization and multi-layer processes.
- Highest resolution, high contrast.
- Poly(methyl methacrylate) with diff. molecular weights.
AR-P 632.04 Properties:
- Film thickness/4.000 rpm: 0.06 µm
- Resolution best value: 6 nm
- Flash point: 44 °C
- Storage 6 month: 10-22 °C
AR-P 632.08 Properties:
- Film thickness/4.000 rpm: 0.11 µm
- Resolution best value: 6 nm
- Flash point: 44 °C
- Storage 6 month: 10-22 °C
AR-P 632.12 Properties:
- Film thickness/4.000 rpm: 0.17 µm
- Resolution best value: 6 nm
- Flash point: 44 °C
- Storage 6 month: 10-22 °C
Available to order in pack sizes:
- 100ml
- 250 ml
- 1L
Pricing available on request.
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Processing Instructions For Coating:
Large undercut structures (lift-off) are obtained if PMMA resists with different molecular weight are chosen for a two component system. As upper layer, an ethyl lactate PMMA is recommended since ethyl lactate does not, in contrast to other solvents, attack the second layer. For the lower layer, a chlorobenzene, anisole or ethyl lactate PMMA is suitable. Both tempering steps are performed at 150 °C.
Recommendation: large undercut (low resolution): bottom layer 50K, upper layer 200K, 600K or 950K. High resolution (smaller undercut): bottom layer 600K, upper layer 950K.