By ALLRESIST GmbH
Supplier InfoProduct Type:
Parts & Consumables
Application:
Chemicals & Photoresists
Product Description:
AR-P 8100 Series (Phoenix 81) is a range of positive-tone photoresists developed for high-resolution lithography applications in semiconductor, MEMS, microsystems, and advanced microfabrication processes. The series offers excellent pattern definition, reliable adhesion, and consistent processing performance, making it suitable for both research and production environments.
Phoenix 81 photoresists are designed to provide precise pattern transfer and good process stability across a range of substrate materials. The resists support fine-feature fabrication while maintaining uniform coating characteristics and reproducible results throughout the lithography process.
Characterisation
- for tSPL (thermal Scanning Probe Lithography)
- film thickness 20 – 160 nm
- high resolution (< 10 nm) and very high contrast
- very process-stable
- not photosensitive > 300 nm
- well suited for two-layer processes (lift-off)
- for the production of „overlay-patterns“
- application in grey-tone & e-beam lithography
- solution of PPA in safer solvent anisole
AR-P 8100.03 Properties:
- Solids content: 3%
- Film thickness/4.000 rpm: 0.03 µm
- Resolution: 10 nm
- Storage temperature: -18 °C
AR-P 8100.06 Properties:
- Solids content: 18%
- Film thickness/4.000 rpm: 0.80 µm
- Resolution: 10 nm
- Storage temperature: -18 °C
Pricing and pack sizes available on request.
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Anionically polymerized polyphalaldehyde (PPA), the base polymer for the thermo-structurable resist Phoenix 81, is a white powder which is storage-stable for at least 4 weeks at room temperature. PPA can thus be shipped with standard shipping and does not require the highly cost-intensive refrigerated transport of PPA solutions. When stored in a refrigerator (8 – 12 °C), the PPA polymer is stable for at least 6 months. For long-term-storage, we recommend temperatures of -18 °C since this ensures that PPA remains stable for at least one year.




