AR Removers

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By ALLRESIST GmbH

Supplier Info

Product Type:

Parts & Consumables


Application:

Chemicals & Photoresists


Product Description:

AR-P 600-71, 300-76, 300-70, 300-72, 300-73 removers
For the stripping of tempered photoresist and e-beam resist films

Characterisation

  • aqueous-alkaline solution (AR 300-73) or organic solvents (all others)

Remover recommendations after tempering

  • photoresists up to 180 °C: AR 600-71, 300-76
  • photoresists up to 200 °C: AR 300-76, 300-71
  • PMMAs up to 200 °C: AR 600-71, 300-76
  • copolymers up to 210 °C: AR 600-71, 300-76
  • CSAR 62 up to 200 °C: AR 600-71, 300-76
  • novolac e-beam resists 150 °C: AR 300-73, 300-76


AR 600-71 Properties:

  • Main component(s): dioxolane
  • Density at 20 °C: 1.02 g/cm3
  • Non-volatiles max.: 0.002 %
  • Flash point: 3 °C
  • Filtration: 0.2 µm
  • Storage temperature: 10-18 °C
  • Available to order in 2.5L bottles

AR 300-76 Properties:

  • Main component(s): DMG
  • Density at 20 °C: 1.08 g/cm3
  • Non-volatiles max.: 0.002 %
  • Flash point: 103 °C
    Filtration: 0.2 µm
    Storage temperature: 10-22 °C
    Available to order in 2.5L bottles

AR 300-70,-72 Properties:

  • Main component(s): NEP
  • Density at 20 °C: 1.03 g/cm3
  • Non-volatiles max.: 0.002 %
  • Flash point: 98 °C
  • Filtration: 0.2 µm
  • Storage temperature: 10-22 °C
  • Available to order in 2.5L bottles

AR 300-73 Properties:

  • Main component(s): TMAH
  • Density at 20 °C: 1.00 g/cm3
  • Non-volatiles max.: 0.002 %
  • Flash point: –
  • Filtration: 0.2 µm
  • Storage temperature: 10-18 °C
  • Available to order in 2.5L bottles

Pricing for all available on request.

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Processing instructions for removers:

Substrates coated with resist are exposed to the effect of the remover by immersion (puddle or dip). To reduce the dissolution time for tempered layers, removers AR 300-70, 300-72 and 300-76 may be heated to up to 80 °C, remover AR 300-73 to up to 50 °C or megasound may be helpful in this case. It is recommended to rinse off the remover with DI water, clean remover or with a suitable thinner. A stripping of very hard-baked layers (> 220 °C) with remover is hardly possible any more. In this case, oxidizing acids or oxygen plasma may be used for stripping. Further detailed remover specifications for a large variety of resists are listed on the following pages.


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