By ALLRESIST GmbH
Supplier Info
Product Type:
Parts & Consumables
Application:
Chemicals & Photoresists
Product Description:
The Allresist SX AR-N 4340/7 is a solvent-free, high-resolution negative photoresist developed as part of Allresist’s SX (Solvent eXtended) platform, designed to meet the demands of advanced semiconductor, MEMS, and micro-/nanofabrication applications while supporting safer and more sustainable processing.
Characterisation:
- i-line, g-line, deep UV (248-266 nm)
- highest sensitivity, high resolution
- good adhesion properties, high contrast, chemically enhanced
- undercut profiles (lift-off) are possible
- may be used with AR-BR 5400 as 2-layer system
- plasma etching stabel, thermostable up to 300 °C
- polyhydroxystyrene polymer, with photochemical acid generator and aminic crosslinker
- Safer solvent PGMEA
SX AR-N 4340/7 Properties
- Solids content: 25%
- Viscosity 25 °C: 38 mPas
- Film thickness/4.000 rpm: 1.4 µm
- Resolution: 0.7 µm
- Flash Point: 44 °C
- Storage temperature: 10-18 °C
Pricing and pack sizes available on request.
There are currently no videos available.
Processing Instructions for the Generation of Lift-Off Structures and Supplementary Information
An undercut of the resist structure (lift-off) can be obtained with a prolonged development after minimum exposure. The undercut and structures with vertical side walls remain even at high temperatures of up to 300 °C. This high temperature stability is also used in the two-layer system with AR-BR 5400 and allows intensive sputtering processes at very high temperatures (see product information AR-BN 5400).