SX AR-PC 5000/41

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By ALLRESIST GmbH

Supplier Info

Product Type:

Parts & Consumables


Application:

Chemicals & Photoresists


Product Description:

Allresist SX AR-PC 5000/41 is a high-performance, solvent-free protective coating designed for demanding semiconductor, MEMS, and microfabrication processes. It is specifically formulated to protect sensitive surface structures during aggressive wet-chemical and dry processing steps.

The SX formulation is cyclohexanone-free, making AR-PC 5000/41 particularly suitable for cleanroom environments and applications requiring reduced solvent emissions. The coating forms a uniform, mechanically stable film that provides excellent resistance against a wide range of acids, bases, and etchants commonly used in microfabrication.

AR-PC 5000/41 can be applied by standard spin-coating techniques and exhibits good adhesion on typical substrates such as silicon, silicon dioxide, silicon nitride, metals, and compound semiconductor materials. The coating maintains its integrity during thermal processing and offers reliable protection during etching, cleaning, and wafer handling steps.

Removal of the protective layer is straightforward using appropriate Allresist removers, enabling clean and residue-free stripping without damaging underlying structures.

Characterisation

  • not light-sensitive > 300 nm, no yellow light required


SX AR-PC 5000/41 Properties:

  • Solids content: 50%
  • Viscosity 25 °C: 45 mPas
  • Film thickness/4.000 rpm: 5.0 µm
  • Resolution: 20 µm
  • Flash Point: 15 °C
  • Storage 6 month: 15-22 °C

Available to order in pack sizes:

  • 100 ml
  • 250 ml
  • 1L

Pricing available on request.

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Processing instructions

Coating: A spin speed of 1000 rpm is recommended, since wafer edges are optimally protected due to the slight wrapping effect at a film thickness of approx. 10 µm during spin deposition.

Etch process: The protective layer is not attacked over hours.

Note: The protective film is not dissolved in acetone or isopropanol. For removal or cleaning of equipment, the respective thinner has to be used.


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